Bandai China has revealed the first details for its new GUNDAM XMX GunPla project at Wonder Festival 2026 Shanghai, introducing a new series aimed at the mainland Chinese market.
The first batch of GUNDAM XMX products is planned for Spring 2027, with the presentation showing a price of 59.5 yuan, roughly US$9.
The series appears to be taking a blind box-style approach, with multiple batches of products planned for release. The exact scale has not been confirmed yet, but the kit appears to be roughly the same size as an HG / MGSD GunPla.
The RX-78-2 Gundam is already being prepared as part of the second batch, although no release date has been announced for the mobile suit yet.
Bandai China also teased more GUNDAM XMX products currently in development, with Mobile Suit Gundam 00, Mobile Suit Gundam, and Mobile Suit Gundam UC all featured in the presentation.
For now, Bandai has only revealed the initial details of the project, with more information expected as development continues toward the Spring 2027 launch.
Here are some screenshots from a bilibili video
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